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Freescale Semiconductor Technical Data
Document Number: MPVZ5150 Rev 0, 11/2006
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
The MPVZ5150 series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. Features * * * * * 2.5% Maximum Error over 0 to 85C Ideally suited for Microprocessor or Microcontroller-Based Systems Patented Silicon Shear Stress Strain Gauge Easy-to-Use Chip Carrier Option Increased media compatibility fluorocarbon gel
MPVZ5150 SERIES
INTEGRATED PRESSURE SENSOR 0 to 150 kPa (0 to 21.75 PSI) 0.2 to 4.7 V Output
SMALL OUTLINE PACKAGES
MPVZ5150GC6T1 CASE 482A-01
MPVZ5150GC7U CASE 482C-03
Typical Applications * * * * Level Indicators Process Control Pump/Motor Control Pressure Switching PIN NUMBER(1)
1 2 3 4 N/C VS GND VOUT 5 6 7 8 N/C N/C N/C N/C
ORDERING INFORMATION
Device Type Options Case No. 482A 482C MPX Series Order Device Marking Number MPVZ5150GC6T1 MPVZ5150G MPVZ5150GC7U MPVZ5150G
1. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin1 is noted by the notch in the lead.
MPVZ5150 SERIES Ported Gauge, Axial Port, SMT Elements Gauge, Axial Port, DIP
VS
Sensing Element
Thin Film Temperature Compensation and Gain Stage # 1
Gain Stage # 2 and Ground Reference Shift Circuitry
VOUT
Pins 1 and 5 through 8 are NO CONNECTS GND
Figure 1. Fully Integrated Pressure Sensor Schematic
(c) Freescale Semiconductor, Inc., 2006. All rights reserved.
TABLE 1. Maximum Ratings(1)
Rating Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol PMAX TSTG TA Value 400 -40 to +125C -40 to +125C Unit kPa C C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
TABLE 2. Operating Characteristics (VS = 5.0 VDC, TA = 25C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 4 required to meet electrical specifications.)
Characteristic Pressure Range(1)
(2)
Symbol POP VS IO (0 to 85C) VOFF VFSO VFSS -- V/P
Min 0 4.75 -- 0.088 4.588 -- -- -- -- -- -- --
Typ -- 5.0 7.0 0.200 4.700 4.500 -- 30 1.0 0.1 20 0.5
Max 150 5.25 10 0.313 4.813 -- 2.5 -- -- -- -- --
Unit kPa VDC mAdc VDC VDC VDC %VFSS mV/kPa ms mAdc ms %VFSS
Supply Voltage Supply Current
Minimum Pressure Offset(3) @ VS = 5.0 V Full Scale Output(4) @ VS = 5.0 V Full Scale Span(5) @ VS = 5.0 V Accuracy(6) Sensitivity Response Time
(7)
Differential and Absolute (0 to 85C) Differential and Absolute (0 to 85C)
tR IO+ -- --
Output Source Current at Full Scale Output Warm-Up Offset 1. 2. 3. 4. 5. 6. Time(8)
Stability(9)
7. 8. 9.
1 kPa (kiloPascal) equals 0.145 PSI. Device is ratiometric within this specified excitation range. Offset (VOFF) is defined as the output voltage at the minimum rated pressure. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. Accuracy (error budget) consists of the following: * Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. * Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. * Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25C. * TcSpan: Output deviation over the temperature range of 0 to 85C, relative to 25C. * TcOffset: Output deviation with minimum pressure applied over the temperature range of 0 to 85C, relative to 25C. * Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS at 25C. Response Time is defined as the time for the incremental changed in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. Warm-Up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPVZ5150 2 Sensors Freescale Semiconductor
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
Figure 2 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0 to 85C using the decoupling circuit shown in Figure 4. The output will saturate outside of the specified pressure range. Figure 3 illustrates the Differential or Gauge configuration in the basic chip carrier (Case 482). A gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. Operating characteristics, internal reliability and qualification tests are based on use of dry clean air as the pressure media. Media other than dry clean air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application.
5 4 Output Voltabe (V) 3 2 1 0
Vout = VS*(0.006*P(kPa)+0.04) (PE * TM * 0.006 * Vs) VS = 5.0 V 0.25 Vdc PE = 3.75 kPa TM = 1 @ 0 to 85C TM = 3 @ +125C TM = 3 @ -40C Vs = 5.0 V +/- 0.25 Vdc
Span Range (Typ) 150
MAX TYP
MIN
90
105
120
Pressure (kPa)
135
0
15
30
45
60
75
(Typ) Offset
Figure 2. Output Vs. Pressure Differential
Stainless Steel Cap
Gel Die Coat P1 Wire Bond
Die
Thermoplastic Case
Lead Frame
P2 Differential Sensing Element
Die Bond
Figure 3. Cross Sectional Diagrams (Not to Scale) Figure 4 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended.
+5.0 V
VOUT Vs IPS 1.0 F 0.01 F GND
OUTPUT
470 pF
Figure 4. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646)
MPVZ5150 Sensors Freescale Semiconductor 3
Output Range (Typ)
Transfer Function (MPVZ5150 Series) Nominal Transfer Value: VOUT = VS x (0.006 x P(kPa) + 0.04) (Pressure Error x Temp. Mult. x 0.006 x VS) VS = 5.0 V 0.25 Vdc Temperature Error Multiplier MPVZ5150 Series
Break Points 4.0 3.0 2.0 1.0 0.0 -40 -20 0 20 40 60 Temperature in C 80 100 120 140 Temp - 40 0 to 85C +125 Multiplier 3 1 3
Note: The Temperature Multiplier is a linear response from 0 to -40C and from 85 to 125C.
Pressure Error Band
MPVZ5150 Series
Error Limits for Pressure 4.0 3.0 2.0 Error (kPa) 1.0 0.0 -1.0 -2.0 -3.0 -4.0 Pressure 0 to 150 kPa Error (max) 3.75 kPa 0
25
50
75
100
125
150
Pressure in kPa
MPVZ5150 4 Sensors Freescale Semiconductor
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorocarbon gel which protects the die from harsh media. The MPX pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using Table 3 below.
TABLE 3. PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Part Number MPVZ5150GC6T1 MPVZ5150GC7U Case Type 482A 482C Pressure (P1) Side Identifier Top with Port Attached Top with Port Attached
INFORMATION FOR USING THE SMALL OUTLINE PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total footprint, the packages will self align when subjected to a design. The footprint for the surface mount packages must be solder reflow process. It is always recommended to design the correct size to ensure proper solder connection interface boards with a solder mask layer to avoid bridging and between the board and the package. With the correct shorting between solder.
Figure 5. Small Outline Package Footprint
MPVZ5150 Sensors Freescale Semiconductor 5
PACKAGE DIMENSIONS
-A4 5
D
8 PL
0.25 (0.010)
M
TB
S
A
S
N
-BG
8 1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0 7 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0 7 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17
S
W
V C H J K M
PIN 1 IDENTIFIER
-TSEATING PLANE
DIM A B C D G H J K M N S V W
CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE
-A4 5
N
-BG
8 1
0.25 (0.010)
M
TB
D 8 PL S A
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL.
S DIM A B C D G J K M N S V W SEATING PLANE INCHES MILLIMETERS MAX MAX MIN MIN 10.79 0.425 10.54 0.415 10.79 0.425 10.54 0.415 13.21 0.520 12.70 0.500 0.864 0.66 0.034 0.026 0.100 BSC 2.54 BSC 0.28 0.23 0.011 0.009 3.05 2.54 0.120 0.100 15 0 15 0 11.38 0.448 11.28 0.444 14.22 0.560 13.72 0.540 6.48 6.22 0.255 0.245 3.17 2.92 0.125 0.115
DETAIL X S W
V C
PIN 1 IDENTIFIER
-TK M J DETAIL X
CASE 482C-03 ISSUE B SMALL OUTLINE PACKAGE
MPVZ5150 6 Sensors Freescale Semiconductor
How to Reach Us:
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MPVZ5150 Rev 0 11/2006

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